Thermal & Fluid Components
Water-Cooled Plate
Flow channels, seals, interfaces and integrated machining to meet equipment thermal management needs.
PRODUCT FEATURES
Features
- 01
Integrated flow-channel and seal design
- 02
Custom water-circuit interfaces
- 03
Helium leak testing and reliability validation available
APPLICATION
Applications
For thermal management in semiconductor, photovoltaic and automation equipment.
SPECIFICATIONS
Specifications
Information below is based on our published company brochure. Final specifications are subject to project drawings and technical confirmation.
- Customization
- Dimensions, flow channels, seals and interfaces
- Machining Capabilities
- Precision machining and welding
- Validation Capabilities
- Sealing and reliability tests for the operating conditions
CUSTOMIZED SOLUTIONS