Semiconductor Heating Assemblies
Semiconductor Wafer Heater Plate
Wafer heating assemblies for thin-film deposition and etching equipment, supporting multiple vacuum welding processes.
PRODUCT FEATURES
Features
- 01
Friction welding, vacuum brazing or vacuum electron-beam welding
- 02
High thermal-field uniformity
- 03
Developed for import substitution and equipment compatibility
APPLICATION
Applications
For semiconductor equipment including thin-film deposition and etching systems.
SPECIFICATIONS
Specifications
Information below is based on our published company brochure. Final specifications are subject to project drawings and technical confirmation.
- Temperature Uniformity
- ±0.5%
- Process Capabilities
- Friction welding / Vacuum brazing / Electron-beam welding
- Customization
- Wafer size, chamber structure and interfaces
CUSTOMIZED SOLUTIONS